塑造硬脆材料,例如金属陶瓷,背景技术对于机械加工和基于高能束的增材制造两者而言,在微米分辨率下一直是已知的挑战。数字光处理(DLP),其特点是伟大的印刷质量和体面的精度,不幸的是,由于其颗粒的巨大光吸收,因此缺乏处理流行的浆料型金属陶瓷前体的能力。这里,设计了一种基于通用可折叠矩阵的创新协议,以允许在DLP平台上高精度打印WC-Co金属陶瓷。通过调整外部环境,这种基质使复合粉末衰减,以促进印刷阶段的光聚合,并在热烧结之前收缩以冷凝生坯部件。通过可塌陷的基质辅助DLP获得的样品可以达到约90%的相对密度,破纪录的分辨率约为10微米,和高达14.5GPa的显微硬度。复杂的精巧结构,包括校徽,蜂窝,微钻可以直接制造,这是以前从未实现过的。令人印象深刻的是,获得的微型钻头能够直接用于钻井任务。上述策略通过使得能够以高分辨率成形强光衰减材料,代表了DLP的巨大进步。这些优点对于下一代陶瓷-金属复合材料增材制造是理想的。
Shaping hard and brittle materials, e.g. cermets, at micrometer resolution has long been known challenging for both mechanical machining and high energy beam based additive manufacturing. Digital light processing (DLP), which features great printing quality and decent precision, unfortunately lacks capability to deal with the popular slurry-typed cermet precursor due to the tremendous optical absorption by its particles. Here, an innovative protocol based on a versatile collapsable matrix is devised to allow high-precision printing of WC-Co cermets on DLP platform. By tuning the external environment, this matrix attenuates composite powders to facilitate photopolymerization at the printing stage, and shrinks to condense green parts prior to thermal sintering. The as-obtained samples by collapsable matrix assisted DLP can reach a relative density of ≈90%, a record-breaking resolution of ≈10 µm, and a microhardness of up to 14.5 GPa. Complex delicate structures, including school emblem, honeycomb, and micro-drill can be directly fabricated, which has never been achieved before. Impressively, the as-obtained micro-drill is able to be directly used in drilling tasks. The above strategy represents a great progress in DLP by enabling shaping strong light attenuating materials at high resolution. Such advantages are ideal for the next generation ceramic-metal composite additive manufacturing.