pFIB

PFIB
  • 文章类型: Journal Article
    微晶电子衍射(MicroED)已经成为一种强大的技术,可以从X射线衍射太小的微晶中解开分子结构。然而,一个重要的障碍出现与板状晶体一致定向自己平在电子显微镜网格。如果板的法线与晶格的轴相关,可用于测量的晶体取向受到限制,因为晶体不能任意旋转。这限制了可以获取的信息,导致信息缺失。我们最近引入了一种称为悬浮液滴结晶的新型结晶策略,并提出悬浮液滴中的晶体可以有效地解决优选晶体取向的挑战。在这里,我们证明了悬浮滴法在消除两个样品中缺失的锥体的成功,这些样品结晶为薄板:牛肝过氧化氢酶和SARS-CoV-2主要蛋白酶(Mpro)。这种创新的解决方案被证明是必不可少的晶体表现出系统的首选取向,为MicroED确定结构解锁新的可能性。
    Microcrystal electron diffraction (MicroED) has emerged as a powerful technique for unraveling molecular structures from microcrystals too small for X-ray diffraction. However, a significant hurdle arises with plate-like crystals that consistently orient themselves flat on the electron microscopy grid. If the normal of the plate correlates with the axes of the crystal lattice, the crystal orientations accessible for measurement are restricted because the crystal cannot be arbitrarily rotated. This limits the information that can be acquired, resulting in a missing cone of information. We recently introduced a novel crystallization strategy called suspended drop crystallization and proposed that crystals in a suspended drop could effectively address the challenge of preferred crystal orientation. Here we demonstrate the success of the suspended drop approach in eliminating the missing cone in two samples that crystallize as thin plates: bovine liver catalase and the SARS‑CoV‑2 main protease (Mpro). This innovative solution proves indispensable for crystals exhibiting systematic preferred orientations, unlocking new possibilities for structure determination by MicroED.
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  • 文章类型: Journal Article
    孔隙网络和主要阶段的可视化和量化一直是胶凝材料的关键研究课题,因为许多关键的机械和化学性质以及基础设施的可靠性都依赖于这些3D特性。在这项研究中,我们首次使用等离子聚焦离子束(PFIB)对波特兰水泥砂浆进行了中尺度连续切片和分析,分析达到80μm×90μm×60μm。使用砂浆和PFIB的工作流程是建立的,应用预先放置的硬硅掩模以减少幕布。使用经过训练的神经网络进行最小人为干扰的分割,其中比较了多种类型的分割模型。将微尺度PFIB分析与X射线显微计算机断层扫描相结合,可以进行从数百纳米(nm)到毫米(mm)的毛细管孔和空气空隙的分析。大毛细管孔和气孔的体积分数分别为11.5%和12.7%,分别。此外,相连的毛细管孔的骨架化清楚地显示了流体运输途径,是决定混凝土在侵蚀性环境中耐久性能的关键因素。FIB层析成像的另一个有趣的方面是无水相的重建,这可以直接研究各个水泥相的水化动力学。
    The visualisation and quantification of pore networks and main phases have been critical research topics in cementitious materials as many critical mechanical and chemical properties and infrastructure reliability rely on these 3D characteristics. In this study, we realised the mesoscale serial sectioning and analysis up to ∼80 μm by ∼90 μm by ∼60 μm on portland cement mortar using plasma focused ion beam (PFIB) for the first time. The workflow of working with mortar and PFIB was established applying a prepositioned hard silicon mask to reduce curtaining. Segmentation with minimal human interference was performed using a trained neural network, in which multiple types of segmentation models were compared. Combining PFIB analysis at microscale with X-ray micro-computed tomography, the analysis of capillary pores and air voids ranging from hundreds of nanometres (nm) to millimetres (mm) can be conducted. The volume fraction of large capillary pores and air voids are 11.5% and 12.7%, respectively. Moreover, the skeletonisation of connected capillary pores clearly shows fluid transport pathways, which is a key factor determining durability performance of concrete in aggressive environments. Another interesting aspect of the FIB tomography is the reconstruction of anhydrous phases, which could enable direct study of hydration kinetics of individual cement phases.
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  • 文章类型: Journal Article
    铟(In)和其他低熔点金属被用作各种混合电路中的互连,并且对这些互连的冶金的充分理解对于器件的可靠性和性能很重要。本文研究了室温聚焦离子束(FIB)制备的横截面,使用Ga+或Xe+可导致模糊真实In微凸块结构的伪影。使用改进的铣削策略来最小化增加的局部样品温度显示出在某些样品配置中代表凸点微观结构的横截面。此外,将样品冷却至低温,可以可靠地消除In凸块的FIB制备的横截面中的伪影,从而可以观察到真实的凸块微观结构。
    Indium (In) and other low melting point metals are used as interconnects in a variety of hybridized circuits and a full understanding of the metallurgy of these interconnects is important to the reliability and performance of the devices. This paper shows that room temperature focused ion beam (FIB) preparation of cross-sections, using Ga+ or Xe+ can result in artifacts that obscure the true In microbump structure. The use of modified milling strategies to minimize the increased local sample temperature are shown to produce cross-sections that are representative of the In bump microstructure in some sample configurations. Furthermore, cooling of the sample to cryogenic temperatures is shown to reliably eliminate artifacts in FIB prepared cross-sections of In bumps allowing the true bump microstructure to be observed.
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  • 文章类型: Journal Article
    在用镓(Ga)和氙(Xe)聚焦离子束(FIB)制备的电子透明透射电子显微镜(TEM)样品之间进行直接比较,以确定是否可以用两种离子种类制备同等质量的样品。我们使用GaFIB和Xe等离子体聚焦离子束(PFIB)制备样品,同时改变各种不同的沉积和铣削参数。使用STEM-EELSt/λ数据评估样品的最终厚度。使用GaFIB样品作为标准,我们将XePFIB样品与标准品和彼此进行了比较。我们表明,尽管XePFIB样品制备技术与GaFIB技术有很大不同,有可能生产高质量的,具有XePFIB的大面积TEM样品。我们还描述了XePFIBTEM样品制备工作流程的最佳实践,以使任何周到的FIB操作员都能获得一致的成功。对于XePFIB,我们表明,必须在最终样品厚度和电子透明区域的尺寸之间做出决定。
    A direct comparison between electron transparent transmission electron microscope (TEM) samples prepared with gallium (Ga) and xenon (Xe) focused ion beams (FIBs) is performed to determine if equivalent quality samples can be prepared with both ion species. We prepared samples using Ga FIB and Xe plasma focused ion beam (PFIB) while altering a variety of different deposition and milling parameters. The samples’ final thicknesses were evaluated using STEM-EELS t/λ data. Using the Ga FIB sample as a standard, we compared the Xe PFIB samples to the standard and to each other. We show that although the Xe PFIB sample preparation technique is quite different from the Ga FIB technique, it is possible to produce high-quality, large area TEM samples with Xe PFIB. We also describe best practices for a Xe PFIB TEM sample preparation workflow to enable consistent success for any thoughtful FIB operator. For Xe PFIB, we show that a decision must be made between the ultimate sample thickness and the size of the electron transparent region.
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  • 文章类型: Journal Article
    飞秒激光器(fs激光器)的发展具有对材料进行极快的无热烧蚀的能力,这引发了材料科学的复兴。fs激光器的样品铣削速率比当前使用的传统聚焦离子束(FIB)源的数量级大。结合最小的表面后处理要求,这项技术被证明是材料研究的游戏规则改变者。与聚焦离子束扫描电子显微镜(LaserFIB)相连的飞秒激光器的开发使许多新功能得以实现,包括进入深埋结构以及生产非常大的沟槽,横截面,柱和TEMH形棒,同时保留微观结构并避免或减少FIB抛光。由于该技术在晶体学领域中的应用,现在可以实现几种高影响的应用。电子,机械工程,电池研究和材料样品制备。这篇综述文章总结了这项新技术的当前机遇,重点是工程材料的材料科学大趋势,能源材料和电子。
    The development of the femtosecond laser (fs laser) with its ability to provide extremely rapid athermal ablation of materials has initiated a renaissance in materials science. Sample milling rates for the fs laser are orders of magnitude greater than that of traditional focused ion beam (FIB) sources currently used. In combination with minimal surface post-processing requirements, this technology is proving to be a game changer for materials research. The development of a femtosecond laser attached to a focused ion beam scanning electron microscope (LaserFIB) enables numerous new capabilities, including access to deeply buried structures as well as the production of extremely large trenches, cross sections, pillars and TEM H-bars, all while preserving microstructure and avoiding or reducing FIB polishing. Several high impact applications are now possible due to this technology in the fields of crystallography, electronics, mechanical engineering, battery research and materials sample preparation. This review article summarizes the current opportunities for this new technology focusing on the materials science megatrends of engineering materials, energy materials and electronics.
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  • 文章类型: Journal Article
    最近,双束Xe+等离子体聚焦离子束(Xe+pFIB)仪器已经吸引了对针对感兴趣的局部区域的特定部位透射电子显微镜(TEM)样品制备的越来越多的兴趣,因为与常规Ga+FIB铣削相比,它显示了几个潜在的益处。然而,挑战和问题仍然存在,特别是在FIB引起的人工制品方面,这阻碍了可靠的S/TEM微观结构和成分分析。在这里,我们研究了使用Xe+pFIB与常规Ga+FIB相比用于铝合金的TEM样品制备的功效。检查了样品制备伪影的三个潜在来源,即:(1)植入诱导的缺陷,如两性化,位错,或由于入射光束对样品的离子轰击而在近表面区域中形成气泡;(2)由于源离子的注入而引起的成分伪影和(3)由于铣削过程而引起的材料再沉积。结果表明,与Ga研磨相比,XepFIB研磨能够产生改进的STEM/TEM样品,因此是首选的标本制备路线。还提出了用于最小化由Xe+pFIB和Ga+FIB诱导的伪影的策略。LAY描述:FIB(聚焦离子束)仪器已成为制备特定地点TEM标本的最重要系统之一,其厚度通常为50-100nm。铝合金的TEM试样制备尤其具有挑战性,按照惯例,Ga离子FIB会在这些材料中产生伪像,使微结构分析变得困难或不可能。最近,使用惰性气体离子源,比如Xe,具有显著提高的研磨速度和被用于制备各种材料。因此,有必要研究FIB铣削过程中形成的结构缺陷,并评估这些TEM样品中离子诱导的化学污染。在这里,我们探讨了与常规GaFIB相比,使用XePFIB作为Al合金的TEM样品制备路线的可行性和效率。
    Recently, the dual beam Xe+ plasma focused ion beam (Xe+ pFIB) instrument has attracted increasing interest for site-specific transmission electron microscopy (TEM) sample preparation for a local region of interest as it shows several potential benefits compared to conventional Ga+ FIB milling. Nevertheless, challenges and questions remain especially in terms of FIB-induced artefacts, which hinder reliable S/TEM microstructural and compositional analysis. Here we examine the efficacy of using Xe+ pFIB as compared with conventional Ga+ FIB for TEM sample preparation of Al alloys. Three potential source of specimen preparation artefacts were examined, namely: (1) implantation-induced defects such as amophisation, dislocations, or \'bubble\' formation in the near-surface region resulting from ion bombardment of the sample by the incident beam; (2) compositional artefacts due to implantation of the source ions and (3) material redeposition due to the milling process. It is shown that Xe+ pFIB milling is able to produce improved STEM/TEM samples compared to those produced by Ga+ milling, and is therefore the preferred specimen preparation route. Strategies for minimising the artefacts induced by Xe+ pFIB and Ga+ FIB are also proposed. LAY DESCRIPTION: FIB (focused ion beam) instruments have become one of the most important systems in the preparation of site-specific TEM specimens, which are typically 50-100 nm in thickness. TEM specimen preparation of Al alloys is particularly challenging, as convention Ga-ion FIB produces artefacts in these materials that make microstructural analysis difficult or impossible. Recently, the use of noble gas ion sources, such as Xe, has markedly improved milling speeds and is being used for the preparation of various materials. Hence, it is necessary to investigate the structural defects formed during FIB milling and assess the ion-induced chemical contamination in these TEM samples. Here we explore the feasibility and efficiency of using Xe+ PFIB as a TEM sample preparation route for Al alloys in comparison with the conventional Ga+FIB.
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  • 文章类型: Journal Article
    Visualizing bone mineralization and collagen fibril organization at intermediate scales between the nanometer and the hundreds of microns range, is still an important challenge. Similarly, visualizing cellular components which locally affect the tissue structure requires a precision of a few tens of nanometers at maximum while spanning several tens of micrometers. In the last decade, gallium focused ion beam (FIB) equipped with a scanning electron microscope (SEM) proved to be an extremely valuable structural tool to meet those ends. In this study, we assess the capability of a recent plasma FIB-SEM technology which provides a potential increase in measurement speed over gallium FIB-SEM, thus paving the way to larger volume analysis. Nanometer-scale layers of demineralized and mineralized unstained human femoral lamellar bone were sequentially sectioned over volumes of 6-16,000 μm3. Analysis of mineralized tissue revealed prolate ellipsoidal mineral clusters measuring approximately 1.1 µm in length by 700 nm at their maximum diameter. Those features, suggested by others in high resolution studies, appear here as a ubiquitous motif in mineralized lamellar bone over thousands of microns cubed, suggesting a heterogeneous and yet regular pattern of mineral deposition past the single collagen fibril level. This large scale view retained sufficient resolution to visualize the collagen fibrils while also partly visualizing the lacuno-canalicular network in three-dimensions. These findings are strong evidence for suitability of PFIB as a bone analysis tool and the need to revisit bone mineralization over multi-length scales with mineralized tissue.
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  • 文章类型: Journal Article
    氙等离子体聚焦离子束仪(PFIB),在扩展聚焦离子束在新技术推力领域的应用方面具有重要的前景。在本文中,我们探索了TescanFERA3XMHPFIB仪器的操作特性,旨在应对半导体行业当前和未来的挑战。两部分方法,第一部分旨在优化离子柱,第二部分旨在优化标本制备,已经进行了。表征离子柱的详细研究,优化高电流/高磨机速率活动,已经被描述为支持对PFIB的更好理解。此外,一种新的单晶牺牲掩模方法已被开发和实施用于PFIB。使用这种组合方法,我们已经实现了高质量的图像与最小的伪影,同时保留PFIB的较短吞吐量时间。尽管本文介绍的工作是在特定的仪器上进行的,作者希望这些研究将为进一步改进PFIB设计和应用提供一般性见解。
    The xenon plasma focused ion beam instrument (PFIB), holds significant promise in expanding the applications of focused ion beams in new technology thrust areas. In this paper, we have explored the operational characteristics of a Tescan FERA3 XMH PFIB instrument with the aim of meeting current and future challenges in the semiconductor industry. A two part approach, with the first part aimed at optimizing the ion column and the second optimizing specimen preparation, has been undertaken. Detailed studies characterizing the ion column, optimizing for high-current/high mill rate activities, have been described to support a better understanding of the PFIB. In addition, a novel single-crystal sacrificial mask method has been developed and implemented for use in the PFIB. Using this combined approach, we have achieved high-quality images with minimal artifacts, while retaining the shorter throughput times of the PFIB. Although the work presented in this paper has been performed on a specific instrument, the authors hope that these studies will provide general insight to direct further improvement of PFIB design and applications.
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