This paper presents the results of the optimisation and characterization of Miscanthus fibre reinforced geopolymer foams based on fly ash and represents an important step forward in the development of a sustainable and environmentally friendly insulation material. Miscanthus belongs to a promising group of renewable raw materials with favourable thermal insulation properties. Design of experiment (DoE) were used to optimize the thermal conductivity and compressive strength of Miscanthus x giganteus reinforced geopolymer foams. In addition, the samples was analyzed using X-ray diffraction (XRD), Field emission scanning electron microscopy (SEM) and Fourier-Transform Infrared Spectroscopy (FTIR). Mixtures with a low thermal conductivity of 0.056 W (m K)-1 and a porosity of 79 vol% achieved a compressive strength of only 0.02 MPa. In comparison, mixtures with a thermal conductivity of 0.087 W (m K)-1 and a porosity of 58 vol% achieved a compressive strength of 0.45 MPa. Based on the determined parameters especially due to the low compressive strength, an application as cavity insulation or insulation between rafters is possible.

Combining thermal conductive fillers and flexible polymers is an agile approach to fabricating composites with heat-conducting performance. However, the thermal conductivity of the composites is hard to reach an equal level to the functional fillers. The mainspring is that the thermally conductive pathways within the composite could not be well-constructed due to the air-induced interface thermal resistance. Herein, inspired by the plant cell wall structure, polyvinyl alcohol (PVA) with abundant hydroxyl groups was adopted as a binder for boosting the thermally conductive pathways construction between cellulose nanofiber (CNF) and alkalized hexagonal boron nitride (BN-OH), also for strengthening the mechanical performance of the composite. The results showed that the tensile strength and through-plane thermal conductivity of the composite were high up to 91.0 MPa and 2.2 W m-1 K-1 at 40 wt% PVA content, exhibiting 121 % and 450 % enhancements compared to pure CNF film (41.2 MPa and 0.4 W m-1 K-1). Moreover, the composite also presented high thermal stability (decomposition temperature of onset was 218 °C) and good hydrophobicity properties. Overall, this study innovatively proposes an idea for enhancing the thermal conductivity and improving the mechanical properties of the composite, which is indispensable for developing thermal management materials for next-generation electronics.

Melioration of the through-plane thermal conductivity (TC) of thermal interface materials (TIMs) is a sore need for efficient heat dissipation to handle an overheating concern of high-power-density electronics. Herein, we constructed a snail shell-like thermal conductive framework to facilitate vertical heat conduction in TIMs. With inspiration from spirally growing calcium carbonate platelets of snail shells, a facile double-microrod-assisted curliness method was developed to spirally coil boron nitride nanosheet (BNNS)/aramid nanofiber (ANF) laminates where interconnected BNNSs lie along the horizontal plane. Thus, vertical alignment of BNNSs in the resultant TIM was achieved, exhibiting a through-plane TC enhancement of ∼100% compared to the counterpart with randomly distributed BNNSs at the same BNNS addition (50 wt %). The Foygel\'s nonlinear model revealed that this unique snail shell-like BNNS framework reduced interfacial thermal resistance by 4 orders of magnitude. Our TIM showed superior interfacial thermal dissipation efficiency, leading to a temperature reduction of 42.6 °C for the LED chip compared to the aforementioned counterpart. Our work paves a valuable way for fabricating high-performance TIMs to ensure reliable operation of electrical devices.

No matter where we reside, the issue of greenhouse gas emissions impacts us all. Their influence has a disastrous effect on the earth\'s climate, producing global warming and many other irreversible environmental impacts, even though it is occasionally invisible to the independent eye. Phase change materials (PCMs) can store and release heat when it is abundant during the day (e.g., from solar radiation), for use at night, or on chilly days when buildings need to be heated. As a consequence, buildings use less energy to heat and cool, which lowers greenhouse gas emissions. Consequently, research on thermally active medium-density fiberboard (MDF) with PCMs is presented in this work. MDF is useful for interior design and furniture manufacturing. The boards were created using pine (Pinus sylvestris L.) and spruce (Picea abies L.) fibers, urea-formaldehyde resin, and PCM powder, with a phase transition temperature of 22 °C, a density of 785 kg m-3, a latent heat capacity of 160 kJ kg-1, a volumetric heat capacity of 126 MJ m-3, a specific heat capacity of 2.2 kJ kgK-1, a thermal conductivity of 0.18 W mK-1, and a maximum operating temperature of 200 °C. Before resination, the wood fibers were divided into two outer layers (16%) and an interior layer (68% by weight). Throughout the resination process, the PCM particles were solely integrated into the inner layer fibers. The mats were created by hand. A hydraulic press (AKE, Mariannelund, Sweden) was used to press the boards, and its operating parameters were 180 °C, 20 s/mm of nominal thickness, and 2.5 MPa for the maximum unit pressing pressure. Five variants of MDF with a PCM additive were developed: 0%, 5%, 10%, 30%, and 50%. According to the study, scores at the MOR, MOE, IB, and screw withdrawal resistance (SWR) tests decreased when PCM content was added, for example, MOE from 3176 to 1057 N mm-2, MOR from 41.2 to 11.5 N mm-2, and IB from 0.78 to 0.27 N mm-2. However, the results of the thickness swelling and water absorption tests indicate that the PCM particles do not exhibit a substantial capacity to absorb water, retaining the dimensional stability of the MDF boards. The thickness swelling positively decreased with the PCM content increase from 15.1 to 7.38% after 24 h of soaking. The panel\'s thermal characteristics improved with the increasing PCM concentration, according to the data. The density profiles of all the variations under consideration had a somewhat U-shaped appearance; however, the version with a 50% PCM content had a flatter form and no obvious layer compaction on the panel surface. Therefore, certain mechanical and physical characteristics of the manufactured panels can be enhanced by a well-chosen PCM addition.

The phonon-related properties of crystalline polymers are highly relevant for various applications. Their simulation is, however, particularly challenging, as the systems that need to be modeled are often too extended to be treated by ab initio methods, while classical force fields are too inaccurate. Machine-learned potentials parametrized against material-specific ab initio data hold the promise of being extremely accurate and also highly efficient. Still, for their successful application, protocols for their parametrization need to be established to ensure an optimal performance, and the resulting potentials need to be thoroughly benchmarked. These tasks are tackled in the current manuscript, where we devise a protocol for parametrizing moment tensor potentials (MTPs) to describe the structural properties, phonon band structures, elastic constants, and forces in molecular dynamics simulations for three prototypical crystalline polymers: polyethylene (PE), polythiophene (PT), and poly-3-hexylthiophene (P3HT). For PE, the thermal conductivity and thermal expansion are also simulated and compared to experiments. A central element of the approach is to choose training data in view of the considered use case of the MTPs. This not only yields a massive speedup for complex calculations while essentially maintaining DFT accuracy, but also enables the reliable simulation of properties that, so far, have been entirely out of reach.

Sub-ambient cooling technologies relying on passive radiation have garnered escalating research attention owing to the challenges posed by global warming and substantial energy consumption inherent in active cooling systems. However, achieving highly efficient radiative cooling devices capable of effective heat dissipation remains a challenge. Herein, by synergic optimization of the micro-pyramid surface structures and 2D hexagonal boron nitride nanoplates (h-BNNs) scattering fillers, pyramid textured photonic films with remarkable solar reflectivity of 98.5% and a mid-infrared (MIR) emittance of 97.2% are presented. The h-BNNs scattering filler with high thermal conductivity contributed to the enhanced through-plane thermal conductivity up to 0.496 W m-1 K-1 and the in-plane thermal conductivity of 3.175 W m-1 K-1. The photonic films exhibit an optimized effective radiative cooling power of 201.2 W m-2 at 40 °C under a solar irradiance of 900 W m-2 and a daily sub-ambient cooling effect up to 11 °C. Even with simultaneous internal heat generation by a 10 W ceramic heater and external solar irradiance of 500 W m-2, a sub-ambient cooling of 5 °C can be realized. The synergic matching strategy of high thermal conductivity scattering fillers and microstructured photonic surfaces holds promise for scalable sub-ambient radiative cooling technologies.

Effective thermal management is crucial for the performance and stability of modern electronics, emphasizing the demand for high thermal conductivity (κ). This review summarizes the latest development in highκ, discussing the emerging theories, innovative materials and practical applications for interfacial heat dissipation. Unique phononic thermal transport behaviors are discussed, including four phonon-phonon scattering, hydrodynamic phonons, surface phonon-polaritons, and more. The review also highlights innovative materials with highκ, such as two-dimensional pentagonal structures, boron carbon nitrogen structures, hexagonal boron arsenide andθ-phase tantalum nitride. In addition, the potential of polymer composites reinforced with highκfillers and surface engineering for advanced electronic applications are also discussed. By integrating these theoretical approaches and material innovations, this review offers comprehensive strategies for enhancing thermal management in modern electronic devices.

Highly thermally conductive and flexible thermal interface materials (TIMs) are desirable for heat dissipation in modern electronic devices. Here, we fabricated a high-crystalline aligned graphene lamella framework (AGLF) with precisely controlled lamella thickness, pore structure, and excellent intergraphene contact by manipulating the thermal expansion behavior of scanning centrifugal casted graphene oxide films. The rational design of the AGLF balances the trade-off between the thermal conductivity and flexibility of TIMs. The AGLF-based TIM (AGLF-TIM) shows a record thermal conductivity of 196.3 W m-1 K-1 with a graphene loading of only 9.4 vol %, which is about 4 times higher than those of reported TIMs at a similar graphene loading. Meanwhile, good flexibility remains comparable to that of commercial TIMs. As a result, an LED device achieves an additional temperature decrease of ∼8 °C with the use of AGLF-TIM compared to high-performance commercial TIMs. This work offers a strategy for the controlled fabrication of graphene macrostructures, showing the potential use of graphene as filler frameworks in thermal management.

Anisotropic cellulose nanofiber (CNF) foams represent the state-of-the-art in renewable insulation. These foams consist of large (diameter >10 μm) uniaxially aligned macropores with mesoporous pore-walls and aligned CNF. The foams show anisotropic thermal conduction, where heat transports more efficiently in the axial direction (along the aligned CNF and macropores) than in the radial direction (perpendicular to the aligned CNF and macropores). Here we explore the impact on axial and radial thermal conductivity upon depositing a thin film of reduced graphene oxide (rGO) on the macropore walls in anisotropic CNF foams. To obtain rGO films on the foam walls we developed liquid-phase self-assembly to deposit rGO in a layer-by-layer fashion. Using electron and ion microscopy, we thoroughly characterized the resulting rGO-CNF foams and confirmed the successful deposition of rGO. These hierarchical rGO-CNF foams show lower radial thermal conductivity (λr) across a wide range of relative humidity compared to CNF control foams. Our work therefore demonstrates a potential method for improved thermal insulation in anisotropic CNF foams and introduces versatile self-assembly for postmodification of such foams.

The optimization of flame retardancy and thermal conductivity in epoxy resin (EP), utilized in critical applications such as mechanical components and electronics packaging, is a significant challenge. This study introduces a novel, ultrasound-assisted self-assembly technique to create a dual-functional filler consisting of carbon nanotubes and ammonium polyphosphate (CNTs@APP). This method, leveraging dynamic ligand interactions and strategic solvent selection, allows for precise control over the assembly and distribution of CNTs on APP surfaces, distinguishing it from conventional blending approaches. The integration of 7.5 wt.% CNTs@APP10 into EP nanocomposites results in substantial improvements in flame retardancy, as evidenced by a limiting oxygen index (LOI) value of 31.8% and achievement of the UL-94 V-0 rating. Additionally, critical fire hazard indicators, including total heat release (THR), total smoke release (TSR), and the peak intensity of CO yield (PCOY), are significantly reduced by 45.9% to 77.5%. This method also leads to a remarkable 3.6-fold increase in char yield, demonstrating its game-changing potential over traditional blending techniques. Moreover, despite minimal CNTs addition, thermal conductivity is notably enhanced, showing a 53% increase. This study introduces a novel approach in the development of multifunctional EP nanocomposites, offering potential for wide range of applications.