Abstract：
Highly thermally conductive and flexible thermal interface materials (TIMs) are desirable for heat dissipation in modern electronic devices. Here, we fabricated a high-crystalline aligned graphene lamella framework (AGLF) with precisely controlled lamella thickness, pore structure, and excellent intergraphene contact by manipulating the thermal expansion behavior of scanning centrifugal casted graphene oxide films. The rational design of the AGLF balances the trade-off between the thermal conductivity and flexibility of TIMs. The AGLF-based TIM (AGLF-TIM) shows a record thermal conductivity of 196.3 W m-1 K-1 with a graphene loading of only 9.4 vol %, which is about 4 times higher than those of reported TIMs at a similar graphene loading. Meanwhile, good flexibility remains comparable to that of commercial TIMs. As a result, an LED device achieves an additional temperature decrease of ∼8 °C with the use of AGLF-TIM compared to high-performance commercial TIMs. This work offers a strategy for the controlled fabrication of graphene macrostructures, showing the potential use of graphene as filler frameworks in thermal management.
摘要：
背景技术高导热和柔性热界面材料(TIM)对于现代电子设备中的散热是期望的。这里,我们制造了一个高结晶排列的石墨烯薄片框架（AGLF），具有精确控制的薄片厚度，孔隙结构,通过操纵扫描离心铸造氧化石墨烯薄膜的热膨胀行为和优异的石墨烯间接触。AGLF的合理设计平衡了TIM的热导率和灵活性之间的权衡。基于AGLF的TIM（AGLF-TIM）显示出196.3Wm-1K-1的记录热导率，石墨烯负载仅为9.4vol％，在相似的石墨烯负载下，这比报道的TIM高约4倍。同时,良好的灵活性仍然与商业TIM相当。因此，ALEDdeviceachievesanadditionaltemperaturedecreaseofto8°CwiththeuseofAGLF-TIMcomparedtohigh-performancecommercialTIM.Thisworkoffersastrategyforthecontrolledfabricationofgraphenemacrostructures,显示石墨烯作为填料骨架在热管理中的潜在用途。
