柔性导电复合材料可用作可穿戴应变传感器,广泛应用于新一代机器人领域,电子皮肤,和人类检测。然而,如何制造同时具有柔韧性的导电复合材料,可拉伸性,自我修复,和传感能力是具有挑战性的研究。在这项工作中,我们创新地设计和制备了一种有机硅聚合物导电复合材料。MXenes和氨基聚(二甲基硅氧烷)通过小生物分子通过酯化反应和席夫碱反应进行修饰,分别。改性的MXenes均匀分散,这使复合材料具有良好的导电性。复合体系中多个氢键和亚胺键的可逆性使其具有理想的拉伸性能和高效的自修复能力,无需外部刺激。含有10重量%A-MXenes的导电复合材料显示出81%的伸长率,其机械强度可达1.81MPa。修复后,拉伸性能和电导率可以恢复到98.4和97.6%,分别。此外,进一步评估导电复合材料的可穿戴应变传感器的价值。即使在切割愈合的过程之后,导电复合材料仍然可以准确检测微小的人体运动(包括说话,吞咽,并按下)。这种基于小生物分子改性的自修复MXene/PDMS弹性体作为可穿戴应变传感器具有巨大的潜力。这种简单的制备方法为未来的多功能柔性电子材料提供了指导。
Flexible conductive composites can be used as wearable strain sensors, which are widely used in the fields of new-generation robotics, electronic skin, and human detection. However, how to make conductive composites that simultaneously possess flexibility, stretchability, self-healing, and sensing capability is challenging research. In this work, we innovatively designed and prepared a silicone polymer conductive composite. MXenes and amino poly(dimethylsiloxane) were modified by small biomolecules via an esterification reaction and a Schiff base reaction, respectively. The modified MXenes are uniformly dispersed, which endows the composite with good electrical conductivity. The reversibility of multiple hydrogen bonds and imine bonds in the composite system makes it have ideal tensile properties and high-efficiency self-healing ability without external stimulation. The conductive composite containing 10 wt % A-MXenes showed an elongation of 81%, and its mechanical strength could reach 1.81 MPa. After repair, the tensile properties and the electrical conductivity could be restored to 98.4 and 97.6%, respectively. In addition, the conductive composite is further evaluated for the value of wearable strain sensors. Even after cut-healed processes, the conductive composite can still accurately detect tiny human movements (including speaking, swallowing, and pressing). This kind of self-healing MXene/PDMS elastomers based on the modification of small biomolecules has great potential as wearable strain sensors. This simple preparation method provides guidance for future multifunctional flexible electronic materials.