作为一种新兴的增材制造技术,喷墨打印在微电子领域的应用越来越广泛。然而,由于导电墨滴撞击在平坦基板上的冲击和回弹行为,制造具有所需质量的导线是具有挑战性的,如合适的线宽和线厚,和匹配电阻,当它用于互连多种电子元件,如果没有正确的操作参数配置。为了解决这个研究空白,本文旨在研究工艺参数对导线质量的影响,包括平台温度,打印速度,层数,和延迟时间(液滴到达时间),被选中进行全阶乘实验。首先,确定保证导线连续性的近似参数范围。第二,本研究分析了工艺参数对线路质量的交互影响。第三,构建人工神经网络(ANN)来预测印刷线的质量。结果表明,线宽不会随着层数的增加而增加,线的厚度呈增加趋势。印刷线的低电阻和高纵横比是通过在70°C的平台温度下印刷5层实现的,12.2ms的延迟时间,打印速度为1139.39mm/min。此外,人工神经网络模型可用于预测线宽和线厚,具有优异的性能,除了由于不规则的线边缘而产生的阻力。这项研究为选择适当的打印参数提供了有用的指导,以实现集成电路中3D打印导线的各种质量特性。
As an emerging additive manufacturing technology, inkjet printing has been increasingly applied in microelectronics field. However, due to the impacting and rebounding behaviors of conductive ink droplets impinging onto flat substrates, it is challenging to fabricate conductive lines with desired quality, such as suitable line width and line thickness, and matching resistance when it is used for interconnecting multifarious electronic components if there is not a proper configuration of operating parameters. To address this research gap, this article aims to investigate the effect of process parameters on the quality of conductive lines, including the platform temperature, printing speed, number of layers, and delay time (droplet interarrival time), are selected to conduct a full factorial experiment. First, the approximate parameter ranges for ensuring the continuity of conductive lines are determined. Second, this study analyzes the interactive effect among process parameters on line quality. Third, an artificial neural network (ANN) is constructed to predict the quality of printed lines. Results show that the line width does not increase with an increased number of layers, while the line thickness shows an increasing trend. The low resistance and high aspect ratio of printed line are achieved by printing 5 layers with the platform temperature of 70°C, the delay time of 12.2 ms, and the printing speed of 1139.39 mm/min. Moreover, the ANN model can be used to predict line width and line thickness with excellent performance, except for the resistance due to the irregular line edge. This study provides a useful guide for the selection of appropriate printing parameters to realize a diverse range of quality properties for 3D printed conductive lines in integrated circuits.