本研究旨在建立和优化使用热压花技术制造生物相容性聚合物ParyleneC的3D微结构的工艺。不同的工艺参数,如压花温度,压花力,脱模温度和速度,优化了脱模剂的使用,利用粘合剂微柱作为用例。为了增强与传统半导体制造技术的兼容性,ParyleneC的热压花是从常规的不锈钢基板到硅片平台。此外,此调整包括研究热压印工艺对嵌入ParyleneC中的金属层的影响,确保与先前演示的超薄Parylene印刷电路板(PCB)的兼容性。为了评估产生的微观结构,采用了表征方法的组合,包括光学显微镜(LM)和扫描电子显微镜(SEM),X射线衍射(XRD)X射线光电子能谱(XPS),和傅里叶变换红外光谱(FTIR)。这些方法提供了对形态学的全面见解,化学,考虑到与现有的ParyleneC图案化技术(如等离子蚀刻或激光烧蚀)相比的改进结果,开发的热压印方法产生了优越的结构完整性,其特征在于增加的特征分辨率和增强的侧壁光滑度。这些进步使得该方法特别适合于不同的应用,包括但不限于,传感器光学元件,医用可穿戴设备的粘合接口,和微流体系统。
This study aims to establish and optimize a process for the fabrication of 3D microstructures of the biocompatible polymer Parylene C using hot embossing techniques. The different process parameters such as embossing temperature, embossing force, demolding temperature and speed, and the usage of a release agent were optimized, utilizing adhesive micropillars as a use case. To enhance compatibility with conventional semiconductor fabrication techniques, hot embossing of Parylene C was adapted from conventional stainless steel substrates to silicon chip platforms. Furthermore, this adaptation included an investigation of the effects of the hot embossing process on metal layers embedded in the Parylene C, ensuring compatibility with the ultra-thin Parylene printed circuit board (PCB) demonstrated previously. To evaluate the produced microstructures, a combination of characterization methods was employed, including light microscopy (LM) and scanning electron microscopy (SEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and Fourier-transform infrared spectroscopy (FTIR). These methods provided comprehensive insights into the morphological, chemical, and structural properties of the embossed Parylene C. Considering the improved results compared to existing
patterning techniques for Parylene C like plasma etching or laser ablation, the developed hot embossing approach yields a superior structural integrity, characterized by increased feature resolution and enhanced sidewall smoothness. These advancements render the method particularly suitable for diverse applications, including but not limited to, sensor optical components, adhesive interfaces for medical wearables, and microfluidic systems.