微电子学的不断小型化正在推动纳米制造模式从自上而下向自下而上的转变。自下而上的制造本质上是用原子组装纳米结构的方式,集群,量子点,等。组装过程依赖于纳米结构的合成过程中也存在的纳米沉积,纳米网络的建造和修复,互连,集成电路,和纳米设备。首先,从0D到1D的多种新型纳米材料和纳米结构,甚至2D都是通过纳米焊合成的。第二,纳米结构和金属/半导体-金属/半导体之间的界面连接是通过低温热辅助纳米连接实现的,机械辅助纳米沉积,或冷焊接。最后,2D和3D互连,柔性透明电极,集成电路,和纳米设备的构建,功能,或者通过纳米沉积自我治愈。所有三个纳米制造阶段都遵循“定向依恋”机制的规则。因此,从纳米结构的合成和连接到纳米器件的构建和服务的全寿命自下而上的制造过程可以通过纳米焊有机地集成。作者希望这篇综述能够为未来半导体产业化发展带来一些新的视角,精致设计的技术途径,复杂纳米结构的控制合成和原位表征,以及开发和修复新型纳米设备的策略。
The continuous miniaturization of microelectronics is pushing the transformation of nanomanufacturing modes from top-down to bottom-up. Bottom-up manufacturing is essentially the way of assembling nanostructures from atoms, clusters, quantum dots, etc. The assembly process relies on
nanowelding which also existed in the synthesis process of nanostructures, construction and repair of nanonetworks, interconnects, integrated circuits, and nanodevices. First, many kinds of novel nanomaterials and nanostructures from 0D to 1D, and even 2D are synthesized by
nanowelding. Second, the connection of nanostructures and interfaces between metal/semiconductor-metal/semiconductor is realized through low-temperature heat-assisted
nanowelding, mechanical-assisted
nanowelding, or cold welding. Finally, 2D and 3D interconnects, flexible transparent electrodes, integrated circuits, and nanodevices are constructed, functioned, or self-healed by
nanowelding. All of the three nanomanufacturing stages follow the rule of \"oriented attachment\" mechanisms. Thus, the whole-lifetime bottom-up manufacturing process from the synthesis and connection of nanostructures to the construction and service of nanodevices can be organically integrated by nanowelding. The authors hope this review can bring some new perspective in future semiconductor industrialization development in the expansion of multi-material systems, technology pathway for the refined design, controlled synthesis and in situ characterization of complex nanostructures, and the strategies to develop and repair novel nanodevices in service.