实验室制造的生物二氧化硅(SiO2)纳米颗粒是从废弃生物质(稻壳)中获得的,并通过共电沉积技术在镍基复合膜的生产中用作环保填料。使用XRD对所产生的生物二氧化硅纳米颗粒进行了表征,FTIR,和FE-SEM/EDS。获得了具有高SiO2含量的无定形纳米级生物二氧化硅颗粒。电沉积的各种电流方式,例如直流电(DC),脉动电流(PC),和反向电流(RC)制度,用于从氨基磺酸盐电解质制备Ni和Ni/SiO2薄膜。在有或没有1.0wt的情况下电沉积的Ni膜。使用FE-SEM/EDS(形态/元素分析,圆度),AFM(粗糙度),维氏显微压痕(显微硬度),和薄层电阻。由于加入了SiO2纳米颗粒,Ni/SiO2膜比从纯氨基磺酸盐电解质获得的膜更粗糙。将SiO2添加到氨基磺酸盐电解质中还导致Ni膜的粗糙度和电导率增加。Ni/SiO2薄膜的表面粗糙度值约为44.0%,48.8%,比使用DC生产的纯Ni薄膜大68.3%,PC,和RC制度,分别。使用Chen-Gao(C-G)复合硬度模型评估了Ni和Ni/SiO2薄膜的显微硬度,结果表明,所得Ni/SiO2薄膜比纯Ni薄膜具有更高的硬度。根据所应用的电沉积方案,Ni膜的硬度从使用PC方案获得的Ni/SiO2膜的29.1%增加到使用RC方案获得的95.5%,对于使用RC方案生产的Ni/SiO2薄膜,达到最大值6.880GPa。
Lab-made biosilica (SiO2) nanoparticles were obtained from waste biomass (rice husks) and used as eco-friendly fillers in the production of nickel matrix composite films via the co-
electrodeposition technique. The produced biosilica nanoparticles were characterized using XRD, FTIR, and FE-SEM/EDS. Amorphous nano-sized biosilica particles with a high SiO2 content were obtained. Various current regimes of
electrodeposition, such as direct current (DC), pulsating current (PC), and reversing current (RC) regimes, were applied for the fabrication of Ni and Ni/SiO2 films from a sulfamate electrolyte. Ni films electrodeposited with or without 1.0 wt.% biosilica nanoparticles in the electrolyte were characterized using FE-SEM/EDS (morphology/elemental analyses, roundness), AFM (roughness), Vickers microindentation (microhardness), and sheet resistance. Due to the incorporation of SiO2 nanoparticles, the Ni/SiO2 films were coarser than those obtained from the pure sulfamate electrolyte. The addition of SiO2 to the sulfamate electrolyte also caused an increase in the roughness and electrical conductivity of the Ni films. The surface roughness values of the Ni/SiO2 films were approximately 44.0%, 48.8%, and 68.3% larger than those obtained for the pure Ni films produced using the DC, PC, and RC regimes, respectively. The microhardness of the Ni and Ni/SiO2 films was assessed using the Chen-Gao (C-G) composite hardness model, and it was shown that the obtained Ni/SiO2 films had a higher hardness than the pure Ni films. Depending on the applied
electrodeposition regime, the hardness of the Ni films increased from 29.1% for the Ni/SiO2 films obtained using the PC regime to 95.5% for those obtained using the RC regime, reaching the maximal value of 6.880 GPa for the Ni/SiO2 films produced using the RC regime.