在本文中,我们开发了制造技术,并使用AFM研究了用于超导量子纳米电子学的铝薄膜,SEM,XRD,HRXRR。Al在(111)Si衬底上的两温度步骤准外延生长提供了优先(111)取向的Al多晶膜,并减少了生长凸起,峰-峰粗糙度从70到10nm,织构系数从3.5提高到1.7,同时硬度从5.4提高到16GPa。超导电流密度的未来进展,杂散电容,放松时间,和噪声需要减少结构缺陷密度和表面缺陷,这可以通过使用这种准外延生长技术提高薄膜质量来实现。
In this paper, we develop fabrication technology and study aluminum films intended for superconducting quantum
nanoelectronics using AFM, SEM, XRD, HRXRR. Two-temperature-step quasiepitaxial growth of Al on (111) Si substrate provides a preferentially (111)-oriented Al polycrystalline film and reduces outgrowth bumps, peak-to-peak roughness from 70 to 10 nm, and texture coefficient from 3.5 to 1.7, while increasing hardness from 5.4 to 16 GPa. Future progress in superconducting current density, stray capacitance, relaxation time, and noise requires a reduction in structural defect density and surface imperfections, which can be achieved by improving film quality using such quasiepitaxial growth techniques.