Abstract：
3D printing polymer or metal can achieve complicated structures while lacking multifunctional performance. Combined printing of polymer and metal is desirable and challenging due to their insurmountable mismatch in melting-point temperatures. Here, a novel volume-metallization 3D-printed polymer composite (VMPC) with bicontinuous phases for enabling coupled structure and function, which are prepared by infilling low-melting-point metal (LM) to controllable porous configuration is reported. Based on vacuum-assisted low-pressure conditions, LM is guided by atmospheric pressure action and overcomes surface tension to spread along the printed polymer pore channel, enabling the complete filling saturation of porous structures for enhanced tensile strength (up to 35.41 MPa), thermal (up to 25.29 Wm-1K-1) and electrical (>106 S m-1) conductivities. The designed 3D-printed microstructure-oriented can achieve synergistic anisotropy in mechanics (1.67), thermal (27.2), and electrical (>1012) conductivities. VMPC multifunction is demonstrated, including customized 3D electronics with elevated strength, electromagnetic wave-guided transport and signal amplification, heat dissipation device for chip temperature control, and storage components for thermoelectric generator energy conversion with light-heat-electricity.
摘要：
3D打印聚合物或金属可以实现复杂的结构，同时缺乏多功能性能。聚合物和金属的组合印刷是期望的且具有挑战性的,因为它们在熔点温度中不可克服的失配。这里,一种新型的体积金属化3D打印聚合物复合材料（VMPC），具有双连续相，用于实现耦合的结构和功能，据报道，通过将低熔点金属（LM）填充到可控的多孔结构中来制备。基于真空辅助低压条件，LM受大气压力作用引导，克服表面张力沿印刷聚合物孔通道扩散，使多孔结构的完全填充饱和，以增强拉伸强度（高达35.41MPa），热导率(高达25.29Wm-1K-1)和电导率(>106Sm-1)。设计的3D打印微结构定向可以实现力学中的协同各向异性（1.67），热（27.2），和电导率（>1012）。VMPC多功能演示，包括具有高强度的定制3D电子产品，电磁波导传输和信号放大，芯片温度控制的散热装置，和用于热电发电机光-热-电能量转换的存储组件。
