Abstract：
The micro thermoelectric device (m-TED) boasts features such as adjustable volume, straightforward structure, and precise, rapid temperature control, positioning it as the only current solution for managing the temperature of microelectronic systems. It is extensively utilized in 5G optical modules, laser lidars, and infrared detection. Nevertheless, as the size of the m-TED diminishes, the growing proportion of interface damages the device\'s operational reliability, constraining the advancement of the m-TED. In this study, we used commercially available bismuth telluride materials to construct the m-TED. The device\'s reliability was tested under various temperatures: -40, 85, 125, and 150 °C. By deconstructing and analyzing the devices that failed during the tests, we discovered that the primary cause of device failure was the degradation of the solder layer. Moreover, we demonstrated that encapsulating the device with polydimethylsiloxane (PDMS) could effectively delay the deterioration of its performance. This study sparks new insights into the service reliability of m-TEDs and paves the way for further optimizing device interface design and enhancing the device manufacturing process.
摘要：
微热电装置（m-TED）具有可调节体积，简单的结构，精确，快速温度控制,将其定位为当前唯一的管理微电子系统温度的解决方案。它广泛应用于5G光模块，激光激光雷达,和红外探测。然而，随着m-TED尺寸的减小，接口比例的增长损害了设备的运行可靠性，限制了m-TED的发展。在这项研究中,我们使用市售的碲化铋材料来构建m-TED。在各种温度下测试器件的可靠性：-40、85、125和150°C。通过解构和分析测试过程中失败的设备，我们发现器件失效的主要原因是焊料层的退化。此外，我们证明了用聚二甲基硅氧烷（PDMS）封装器件可以有效地延迟其性能的恶化。这项研究激发了对m-TED服务可靠性的新见解，并为进一步优化设备接口设计和增强设备制造过程铺平了道路。
