Abstract：
In this study, we investigated the binding mode between double-stranded deoxyribonucleic acid (dsDNA) and curcumin (CU) using differential pulse voltammetry (DPV), UV-Vis spectroscopy, and molecular docking. By employing these techniques, we predicted the binding within the minor groove region of dsDNA and CU. Significantly, we employed electrochemistry, specifically cyclic voltammetry (CV), to explore the temperature effect on the dsDNA and CU binding. To the best of our knowledge, this is the first study to utilize electrochemical methods for investigating the temperature-dependent behavior of this binding interaction. Our findings revealed temperature-dependent variations in the binding constants: 2.42 × 103 M-1 at 25 °C, 4.26 × 103 M-1 at 30 °C, 5.44 × 103 M-1 at 35 °C, 6.29 × 103 M-1 at 40 °C, and 7.52 × 103 M-1 at 45 °C. Notably, the binding constant exhibited an increasing trend with elevated temperatures, indicating a temperature-dependent enhancement of the binding interaction.
摘要：
在这项研究中,我们使用差分脉冲伏安法（DPV）研究了双链脱氧核糖核酸（dsDNA）和姜黄素（CU）之间的结合模式，紫外-可见光谱,和分子对接。通过使用这些技术，我们预测了dsDNA和CU的小沟区域内的结合。重要的是,我们采用了电化学，特别是循环伏安法(CV)，探讨温度对dsDNA与CU结合的影响。据我们所知,这是第一个利用电化学方法研究这种结合相互作用的温度依赖性行为的研究。我们的发现揭示了结合常数的温度依赖性变化：25°C时为2.42×103M-1，在30°C时4.26×103M-1，在35°C时5.44×103M-1，在40°C时6.29×103M-1，和7.52×103M-1在45℃。值得注意的是,结合常数随着温度的升高而表现出增加的趋势，表明结合相互作用的温度依赖性增强。
