{Reference Type}: Journal Article
{Title}: Metal-organic framework adhesives with exceptionally high heat resistance.
{Author}: Miyazaki I;Masuoka Y;Suzumura A;Moribe S;Takao H;Umehara M;
{Journal}: Sci Technol Adv Mater
{Volume}: 25
{Issue}: 1
{Year}: 2024
{Factor}: 7.821
{DOI}: 10.1080/14686996.2024.2347193
{Abstract}: We synthesized high-heat-resistant adhesives based on metal - organic frameworks owing to their high decomposition temperature and the absence of a glass transition. Heat-resistance tests were performed on adhesive joints consisting of zeolitic imidazolate framework (ZIF)-67-based adhesives and a copper substrate. The as-synthesized ZIF-67-based adhesive exhibited heat resistances at 600 and 700°C in air and nitrogen atmospheres, respectively, comparable to those of conventional high-heat-resistant polymer-based adhesives. The degradation mechanism of the ZIF-67 adhesives was investigated, and their high heat resistance was attributed to the stable existence of the ZIF-67 qtz phase in the adhesive layer at high temperatures without the formation of voids. Thus, adhesives based on ZIF-67 and other metal - organic frameworks can be applied in high-temperature industrial systems.<BR>By focusing on its high thermal stability and absence of glass transition, the ZIF-67 gel was found to have high potential that is comparable to existing heat-resistant adhesives.