PDF(Pubmed)
Abstract：
Chromium-plated diamond/copper composite materials, with Cr layer thicknesses of 150 nm and 200 nm, were synthesized using a vacuum hot-press sintering process. Comparative analysis revealed that the thermal conductivity of the composite material with a Cr layer thickness of 150 nm increased by 266%, while that with a Cr layer thickness of 200 nm increased by 242%, relative to the diamond/copper composite materials without Cr plating. This indicates that the introduction of the Cr layer significantly enhanced the thermal conductivity of the composite material. The thermal properties of the composite material initially increased and subsequently decreased with rising sintering temperature. At a sintering temperature of 1050 °C and a diamond particle size of 210 μm, the thermal conductivity of the chromium-plated diamond/copper composite material reached a maximum value of 593.67 W∙m-1∙K-1. This high thermal conductivity is attributed to the formation of chromium carbide at the interface. Additionally, the surface of the diamond particles in contact with the carbide layer exhibited a continuous serrated morphology due to the interface reaction. This \"pinning effect\" at the interface strengthened the bonding between the diamond particles and the copper matrix, thereby enhancing the overall thermal conductivity of the composite material.
摘要：
镀铬金刚石/铜复合材料，Cr层厚度为150nm和200nm，使用真空热压烧结工艺合成。对比分析表明，Cr层厚度为150nm的复合材料的热导率增加了266%，而Cr层厚度为200nm时增加了242%，相对于没有镀铬的金刚石/铜复合材料。这表明Cr层的引入显著提高了复合材料的导热性。随着烧结温度的升高，复合材料的热性能最初增加，随后降低。在1050℃的烧结温度和210μm的金刚石粒度下，镀铬金刚石/铜复合材料的热导率达到最大值593.67W·m-1·K-1。这种高热导率归因于在界面处形成碳化铬。此外,由于界面反应，与碳化物层接触的金刚石颗粒的表面表现出连续的锯齿状形态。界面处的“钉扎效应”加强了金刚石颗粒与铜基体之间的结合，从而提高复合材料的整体导热性。
