PDF(Pubmed)
Abstract：
Negative-tone photosensitive polyimides (PSPIs) with a low coefficient of thermal expansion (CTE) were prepared by dissolving polyimide precursor-poly(amide ester) (PAE) resins, photoinitiators, photocrosslinkers and other additives in organic solvents. Using triamine as a monomer and dianhydride and diamine as polycondensates, tri-branched structure PAE resins with different molecular weights named PAE-1~5 were prepared. A series of corresponding PSPI films named PSPI-1~5 were prepared from PAE-1~5 resins with the same formulation, respectively. The PSPI-1~5 films prepared from resins of this structure have excellent mechanical, thermal and electrical properties after being thermally cured at 350 °C/2 h in nitrogen. The PSPI-1~5 films\' coating solution also show good photolithographic performance and are able to obtain photolithographic patterns with a resolution of about 10 μm after homogenization, exposure and development. Among the PSPI-1~5 films, PSPI-2 has the most excellent lithographic properties with a weight average molecular weight (Mw) of 2.9 × 104 g/mol, a CTE of 41 ppk/°C, a glass transition temperature (Tg) of 343 °C and a 5% weight loss temperature (Td5) of 520 °C, making it suitable for industrial scale-up. The mechanical properties of elongation at breakage of 42.4%, tensile moduli of 3.4 GPa and tensile strength of 153.7 MPa were also measured.
摘要：
通过溶解聚酰亚胺前体-聚（酰胺酯）（PAE）树脂，制备了具有低热膨胀系数（CTE）的负型光敏聚酰亚胺（PSPI），光引发剂,有机溶剂中的光交联剂和其他添加剂。使用三胺作为单体，二酐和二胺作为缩聚物，制备了不同分子量的三支化结构PAE树脂PAE-1~5。用相同配方的PAE-1~5树脂制备了一系列相应的PSPI薄膜，命名为PSPI-1~5。分别。由该结构的树脂制备的PSPI-1~5薄膜具有优异的力学性能,在氮气中以350°C/2h热固化后的热和电性能。PSPI-1~5薄膜涂层溶液也显示出良好的光刻性能，并且在均匀化后能够获得分辨率约10μm的光刻图案，曝光和发展。在PSPI-1~5薄膜中,PSPI-2具有最优异的光刻性能，重均分子量（Mw）为2.9×104g/mol，CTE为41ppk/°C，玻璃化转变温度（Tg）为343°C，5%失重温度（Td5）为520°C，使其适合工业规模扩大。力学性能的断裂伸长率为42.4%，还测量了3.4GPa的拉伸模量和153.7MPa的拉伸强度。
