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Abstract：
This article proposes a numerical routine to predict the residual stresses developing in an epoxy component during its curing. The scaling of viscoelastic properties with the temperature and the degree of conversion is modeled, adopting a mathematical formulation that considers the concurrent effects of curing and structural relaxation on the epoxy\'s viscoelastic relaxation time. The procedure comprises two moduli: at first, the thermal-kinetical problem is solved using the thermal module of Ansys and a homemade routine written in APDL, then the results in terms of temperature and the degree of conversion profiles are used to evaluate the viscoelastic functions, and the structural problem is solved in the mechanical module of Ansys, allowing the residual stresses calculation. The results show that the residual stresses mainly arise during cooling and scale with the logarithm of the Biot number.
摘要：
本文提出了一种数值例程来预测环氧树脂组件在固化过程中产生的残余应力。对粘弹性特性随温度和转化程度的缩放进行了建模，采用数学公式，考虑固化和结构松弛对环氧树脂粘弹性松弛时间的同时影响。该过程包括两个模数：首先，使用Ansys的热模块和用APDL编写的自制例程解决了热动力学问题，然后根据温度和转化程度曲线的结果来评估粘弹性函数，在Ansys的机械模块中解决了结构问题，允许残余应力计算。结果表明，残余应力主要出现在冷却过程中，并以Biot数的对数缩放。
